منابع مشابه
Influence of Vacuum Heat Treatment on the Residual Stress of Thermal Spray Cermet Coatings
and light microscopy were used to identify the changes after the heat-treatment. Microhardness and indentation modulus values were also investigated to analyse the changes in the mechanical properties after the heat-treatment. Results of this investigation indicated that the residual stress gradient within the coating material decreases after the heat-treatment, and the stress field in the subs...
متن کاملInfrared Reflectance and Emittance of Silver and Gold Evaporated in Ultrahigh Vacuum
The reflectance of silver and gold evaporated in ultrahigh vacuum has been measured in the wavelength range from 0.5 U to 32 u. It was found that the reflectance of both materials is higher than previously reported values, and that ultrahigh vacuum silver films have the highest infrared reflectance over an extended wavelength range of any known material. The infrared emittance of uhv gold films...
متن کاملStudy of Wavelength Dependence of Optical Constants for Znse Vacuum Evaporated Thin Films
Vacuum evaporated crystalline films of Zinc Selenide (ZnSe) have been characterized by using optical spectroscopy (especially transmission and absorption spectra). Thin films of ZnSe have been deposited by vacuum evaporation technique on highly clean glass substrates and their optical properties such as refractive index (n), extinction coefficient (k), and energy band gap have been studied. The...
متن کاملGrowth rate effect on 3C-SiC film residual stress on (100) Si substrates
SiC is a candidate material for microand nano-electromechanical systems (MEMS and NEMS). In order to understand the impact that the growth rate has on the residual stress of CVD-grown 3C-SiC hetero-epitaxial films on Si substrates, growth experiments were performed and the resulting stress was evaluated. Film growth was performed using a two-step growth process with propane and silane as the C ...
متن کاملResidual Stress and Microstructure of Electroplated Cu Film on Different Barrier Layers
Copper films of different thicknesses between 0.2 and 2 microns were electroplated on adhesion-promoting TiW and Ta barrier layers on <100> single crystal 6-inch silicon wafers. The residual stress was measured after each processing step using a wafer curvature technique employing Stoney’s equation. Large gradients in the stress distributions were found across each wafer. Controlled Cu grain gr...
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ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
سال: 1993
ISSN: 0387-5008,1884-8338
DOI: 10.1299/kikaia.59.2694